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产品简介 Produsts Introduction

本机型主要用于水晶、人造宝石、单晶硅、陶瓷、玻璃、贵重金属、磁性材料等硬脆材料的切片加工。该设备

具有精密温度控制系统，切片精度高，翘曲度小，切片质量稳定，切割成本低。

This series is mainly used for slicing hard and brittle materials such as crystal, artificial gem,

monocrystalline silicon, ceramics, glass, precious metals, magnetic materials, etc. It has a precise temperature control system, high slice precision, small warpage, stable slice quality and

low cutting cost.

切割样品 Cutting sample

机型特点 Characteristics

技术参数 Parameter